We worked with a semiconductor customer to encapsulate conical tapered rods in PFA heat shrink. Used for a semiconductor application, the rods required a specific shrink ratio and as such, we produced a custom sized PFA heat shrink.
Our customer needed to encapsulate their conical tapered rods in PFA heat shrink. Used in the semiconductor industry, the rods varied in diameter along the length, from 35mm to 40mm. The shrink ratio of the PFA heat shrink was critical as the application called for a minimum fully recovered wall thickness of 0.5mm along the length of the rod.
For this project, we produced a bespoke heat shrink with a special wall thickness to meet our customer’s requirements. The PFA heat shrink we custom manufactured had a minimum supplied ID of 44mm which shrank to 32mm diameter and a fully recovered wall thickness of 0.7mm.
Given the encapsulated rods were used for a semiconductor application, PFA was chosen for its high temperature resistance, high purity, long life, smooth surface and chemical resistance. We first produced a trial batch for our customer to evaluate. The PFA heat shrink was then cut to various specific lengths and wound onto a bulk spool.
Encapsulating components with fluoroplastics provides you with a high temperature, chemically inert and non-stick coating. FEP, PFA and PTFE are some of the most inert materials known to man, and they also have a very high temperature resistance. They are ideal materials for the protection of components in applications where highly corrosive or solvent conditions exist.
Using combinations of custom manufacturing techniques in conjunction with thermoforming processes, a coating can be applied on almost any item in FEP, PFA and PTFE. Your components can be encapsulated in heat shrink as well as non-heat shrink tubing. Once applied, all our fluoropolymer coatings are fully inspected and spark tested to ensure the integrity of the seal.